Amtech to Reschedule Third Quarter 2022 Earnings Call to August 15, 2022 and Reports Preliminary Revenue and Diluted EPS

Amtech Systems, Inc. ("Amtech") (NASDAQ: ASYS), a manufacturer of capital equipment, including thermal processing and wafer polishing, and related consumables used in fabricating semiconductor devices, such as silicon carbide (SiC) and silicon power devices, analog and discrete devices, electronic assemblies and light-emitting diodes (LEDs), announced today that it has rescheduled the release of its financial results for the third fiscal quarter ended June 30, 2022, from August 10, 2022, to after market close on August 15, 2022, to allow more time for completion of its quarter-end reporting and auditor review procedures.

Amtech is pleased to announce that revenues for the third fiscal quarter ended June 30, 2022, are $20.0 million and net income per diluted share is $0.73, inclusive of the gain on the sale of its building in Billerica, Massachusetts.

About Amtech Systems, Inc.

Amtech Systems, Inc. is a leading, global manufacturer of capital equipment, including thermal processing and wafer polishing, and related consumables used in fabricating semiconductor devices, such as silicon carbide (SiC) and silicon power devices, analog and discrete devices, electronic assemblies and light-emitting diodes (LEDs). We sell these products to semiconductor device and module manufacturers worldwide, particularly in Asia, North America and Europe. Our strategic focus is on semiconductor growth opportunities in power electronics, sensors and analog devices leveraging our strength in our core competencies in thermal and substrate processing. We are a market leader in the high-end power chip market (SiC substrates, 300mm horizontal thermal reactor, and electronic assemblies used in power, RF, and other advanced applications), developing and supplying essential equipment and consumables used in the semiconductor industry. Amtech's products are recognized under the leading brand names BTU International, Bruce Technologies^™, PR Hoffman^™ and Intersurface Dynamics, Inc.

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