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Articles published by Cadence Design Systems, Inc.

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Cadence Collaborates with Arm to Accelerate Mobile Device Silicon Success with New Arm Total Compute Solutions
From Cadence Design Systems, Inc.
Via Business Wire
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Cadence’s Anirudh Devgan to Present at Bernstein Conference
From Cadence Design Systems, Inc.
Via Business Wire
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Cadence’s John Wall to Present at Needham Conference
From Cadence Design Systems, Inc.
Via Business Wire
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Cadence Appoints Mary Louise Krakauer as Chair of the Board
From Cadence Design Systems, Inc.
Via Business Wire
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Cadence Delivers New Design Flows Based on the Integrity 3D-IC Platform in Support of TSMC 3Dblox™ Standard
From Cadence Design Systems, Inc.
Via Business Wire
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Cadence Digital and Custom/Analog Design Flows Certified for TSMC’s Latest N3E and N2 Process Technologies
From Cadence Design Systems, Inc.
Via Business Wire
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Cadence Collaborates with GUC on AI, HPC and Networking in Advanced Packaging Technologies
From Cadence Design Systems, Inc.
Via Business Wire
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Cadence Custom Design Migration Flow Accelerates Adoption of TSMC N3E and N2 Process Technologies
From Cadence Design Systems, Inc.
Via Business Wire
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Cadence and TSMC Collaborate on N16 79GHz mmWave Design Reference Flow to Accelerate Radar, 5G and Wireless Innovation
From Cadence Design Systems, Inc.
Via Business Wire
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Cadence Reports First Quarter 2023 Financial Results
From Cadence Design Systems, Inc.
Via Business Wire
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Cadence Tapes Out 16G UCIe Advanced Package IP on TSMC’s N3E Process Technology
From Cadence Design Systems, Inc.
Via Business Wire
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Cadence Accelerates Hyperscale SoC Design with Next-Generation 112G Extended Long-Reach SerDes IP on TSMC’s N4P Process
From Cadence Design Systems, Inc.
Via Business Wire
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Cadence Unleashes the Future of Analog, Custom and RFIC Design with Pioneering AI-Powered Virtuoso Studio
From Cadence Design Systems, Inc.
Via Business Wire
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Cadence Demonstrates Interoperability with SK hynix’s Highest Speed LPDDR5T Mobile DRAM at 9600Mbps
From Cadence Design Systems, Inc.
Via Business Wire
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Cadence Extends Collaboration with TSMC and Microsoft to Advance Giga-Scale Physical Verification in the Cloud
From Cadence Design Systems, Inc.
Via Business Wire
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Cadence Introduces EMX Designer, Delivering More Than 10X Increased Performance for On-Chip Passive Component Synthesis
From Cadence Design Systems, Inc.
Via Business Wire
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Cadence Strengthens Tensilica Vision and AI Software Partner Ecosystem for Advanced Automotive, Mobile, Consumer and IoT Applications
From Cadence Design Systems, Inc.
Via Business Wire
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Cadence Announces First Quarter 2023 Financial Results Webcast
From Cadence Design Systems, Inc.
Via Business Wire
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Cadence Introduces Allegro X AI, Accelerating PCB Design with More Than 10X Reduction in Turnaround Time
From Cadence Design Systems, Inc.
Via Business Wire
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Cadence Named One of the 2023 100 Best Companies to Work For® by Fortune and Great Place To Work®
From Cadence Design Systems, Inc.
Via Business Wire
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Cadence Verisium AI-Driven Verification Platform Accelerates Debug Productivity for Renesas
From Cadence Design Systems, Inc.
Via Business Wire
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Cadence to Invest $50 Million to Support Racial Equity
From Cadence Design Systems, Inc.
Via Business Wire
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Cadence’s Anirudh Devgan to Present at Morgan Stanley Conference
From Cadence Design Systems, Inc.
Via Business Wire
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Cadence Delivers 13 New VIP and Expands System VIP Portfolio to Accelerate Automotive, Hyperscale Data Center and Mobile SoC Verification
From Cadence Design Systems, Inc.
Via Business Wire
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Cadence Reports Fourth Quarter and Fiscal Year 2022 Financial Results
From Cadence Design Systems, Inc.
Via Business Wire
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Cadence Quantus FS Solution, a 3D Field Solver, Achieves Certification for Samsung Foundry’s SF4, SF3E and SF3 Process Technologies
From Cadence Design Systems, Inc.
Via Business Wire
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GUC Delivers its First TSMC N3 Chip and First AI-Optimized N5 Design Using Cadence Digital Solutions
From Cadence Design Systems, Inc.
Via Business Wire
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Cadence Announces Fourth Quarter and Fiscal Year 2022 Financial Results Webcast
From Cadence Design Systems, Inc.
Via Business Wire
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Cadence Tensilica HiFi DSP Enables Highly Energy-Efficient Audio Playback for Dolby Atmos for Cars
From Cadence Design Systems, Inc.
Via Business Wire
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Cadence Announces Industry Best-In-Class 8533Mbps LPDDR5X IP Solution for Next-Generation AI, Automotive and Mobile Applications
From Cadence Design Systems, Inc.
Via Business Wire
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